GS81302QT37AGD-333
vs
GS81302Q36AGD-333I
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
GSI TECHNOLOGY
GSI TECHNOLOGY
Package Description
LBGA,
LBGA,
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.B
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Factory Lead Time
24 Weeks
24 Weeks
Samacsys Manufacturer
GSI TECHNOLOGY
Access Time-Max
0.45 ns
0.45 ns
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
Length
15 mm
15 mm
Memory Density
150994944 bit
150994944 bit
Memory IC Type
QDR SRAM
QDR SRAM
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
4MX36
4MX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
13 mm
13 mm
Base Number Matches
1
1
Rohs Code
Compare GS81302QT37AGD-333 with alternatives
Compare GS81302Q36AGD-333I with alternatives