GS81302DT19E-450
vs
CY7C25632KV18-400BZC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Not Recommended
Transferred
Ihs Manufacturer
GSI TECHNOLOGY
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
Package Description
LBGA,
FBGA-165
Pin Count
165
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.B
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Factory Lead Time
24 Weeks
Access Time-Max
0.45 ns
0.45 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
Length
17 mm
15 mm
Memory Density
150994944 bit
75497472 bit
Memory IC Type
QDR II PLUS SRAM
QDR SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
165
165
Number of Words
8388608 words
4194304 words
Number of Words Code
8000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8MX18
4MX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
235
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
1.4 mm
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
20
Width
15 mm
13 mm
Base Number Matches
1
2
Clock Frequency-Max (fCLK)
400 MHz
I/O Type
SEPARATE
JESD-609 Code
e0
Moisture Sensitivity Level
3
Output Characteristics
3-STATE
Package Equivalence Code
BGA165,11X15,40
Standby Current-Max
0.32 A
Standby Voltage-Min
1.7 V
Supply Current-Max
0.71 mA
Terminal Finish
Tin/Lead (Sn/Pb)
Compare GS81302DT19E-450 with alternatives
Compare CY7C25632KV18-400BZC with alternatives