GS81302DT19AGD-375
vs
GS81302Q18AGD-375
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
GSI TECHNOLOGY
GSI TECHNOLOGY
Package Description
LBGA, BGA165,11X15,40
LBGA,
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.B
3A991.B.2.B
HTS Code
8542.32.00.41
8542.32.00.41
Factory Lead Time
24 Weeks
24 Weeks
Date Of Intro
2017-08-29
Access Time-Max
0.45 ns
0.45 ns
Additional Feature
PIPE LINED ARCHITECTURE
Clock Frequency-Max (fCLK)
375 MHz
I/O Type
SEPARATE
JESD-30 Code
R-PBGA-B165
R-PBGA-B165
Length
15 mm
15 mm
Memory Density
150994944 bit
150994944 bit
Memory IC Type
QDR SRAM
QDR SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Ports
1
Number of Terminals
165
165
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
8MX18
8MX18
Output Enable
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reverse Pinout
NO
Seated Height-Max
1.4 mm
1.4 mm
Standby Voltage-Min
1.7 V
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
13 mm
13 mm
Base Number Matches
1
1
Rohs Code
Compare GS81302DT19AGD-375 with alternatives
Compare GS81302Q18AGD-375 with alternatives