GS81302DT10E-300I vs GS81302DT10GE-333T feature comparison

GS81302DT10E-300I GSI Technology

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GS81302DT10GE-333T GSI Technology

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Active Not Recommended
Ihs Manufacturer GSI TECHNOLOGY GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description LBGA, LBGA,
Pin Count 165 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.B 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 24 Weeks
Access Time-Max 0.45 ns 0.45 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
Length 17 mm 17 mm
Memory Density 150994944 bit 150994944 bit
Memory IC Type QDR II PLUS SRAM QDR II PLUS SRAM
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 16MX9 16MX9
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.5 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15 mm 15 mm
Base Number Matches 2 1
JESD-609 Code e1
Moisture Sensitivity Level 3
Terminal Finish TIN SILVER COPPER

Compare GS81302DT10E-300I with alternatives

Compare GS81302DT10GE-333T with alternatives