GS81284Z36B-300T
vs
GS81284Z36GB-300T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GSI TECHNOLOGY
GSI TECHNOLOGY
Part Package Code
BGA
BGA
Package Description
14 X 22 MM, 1.27 MM PITCH, FPBGA-119
BGA,
Pin Count
119
119
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
5.5 ns
5.5 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE;ALSO OPERATES WITH 3.3V
FLOW-THROUGH OR PIPELINED ARCHITECTURE;ALSO OPERATES WITH 3.3V
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
JESD-609 Code
e0
e1
Length
22 mm
22 mm
Memory Density
150994944 bit
150994944 bit
Memory IC Type
ZBT SRAM
ZBT SRAM
Memory Width
36
36
Number of Functions
1
1
Number of Terminals
119
119
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
4MX36
4MX36
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.99 mm
1.99 mm
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
1
1
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Compare GS81284Z36B-300T with alternatives
Compare GS81284Z36GB-300T with alternatives