GS8128418B-200IT vs GS81284Z18GB-250 feature comparison

GS8128418B-200IT GSI Technology

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GS81284Z18GB-250 GSI Technology

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Active Active
Ihs Manufacturer GSI TECHNOLOGY GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description BGA, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, FPBGA-119
Pin Count 119 119
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 7.5 ns 6.5 ns
Additional Feature PIPELINE AND FLOW THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3V TO 3.6V SUPPLY FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES WITH 3.3V
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e0 e1
Length 22 mm 22 mm
Memory Density 150994944 bit 150994944 bit
Memory IC Type CACHE SRAM ZBT SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 8MX18 8MX18
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.99 mm 1.99 mm
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 8
Factory Lead Time 24 Weeks
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260

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