GS8128018GT-200I
vs
GS8128218GD-200IT
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
GSI TECHNOLOGY
GSI TECHNOLOGY
Package Description
LQFP, TQFP100,.4X.6,26
BGA, BGA165,11X15,40
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.B
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Factory Lead Time
24 Weeks
Access Time-Max
6.5 ns
3 ns
Additional Feature
PIPELINE AND FLOW THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3V TO 3.6V SUPPLY
IT CAN ALSO OPERATE AT 3.3V
Clock Frequency-Max (fCLK)
200 MHz
200 MHz
I/O Type
CONFIGURABLE
COMMON
JESD-30 Code
R-PQFP-G100
R-PBGA-B165
Length
20 mm
15 mm
Memory Density
150994944 bit
150994944 bit
Memory IC Type
CACHE SRAM
CACHE SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
100
165
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Organization
8MX18
8MX18
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
BGA
Package Equivalence Code
TQFP100,.4X.6,26
BGA165,11X15,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Reverse Pinout
NO
NO
Seated Height-Max
1.6 mm
1.4 mm
Standby Voltage-Min
2.3 V
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
GULL WING
BALL
Terminal Pitch
0.65 mm
1 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
14 mm
13 mm
Base Number Matches
4
1
Rohs Code
Operating Temperature-Max
100 °C
Operating Temperature-Min
-40 °C
Temperature Grade
INDUSTRIAL
Compare GS8128018GT-200I with alternatives
Compare GS8128218GD-200IT with alternatives