GS78116B-10T vs GS78116AB-12I feature comparison

GS78116B-10T GSI Technology

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GS78116AB-12I GSI Technology

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer GSI TECHNOLOGY GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description BGA, BGA119,7X17,50 BGA,
Pin Count 119 119
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 10 ns 12 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e0 e0
Length 22 mm 22 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 512KX16 512KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA119,7X17,50
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 220 220
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 1.99 mm
Standby Current-Max 0.06 A
Standby Voltage-Min 3 V
Supply Current-Max 0.225 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 14 mm
Base Number Matches 1 1
Samacsys Manufacturer GSI TECHNOLOGY
Additional Feature THIS PACKAGE IS ALSO AVAILABLE IN 2.19 MM SEATED HEIGHT.

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