GS76024AGB-12
vs
EDI8L24257V10BC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Not Recommended
Obsolete
Ihs Manufacturer
GSI TECHNOLOGY
WHITE MICROELECTRONICS
Part Package Code
BGA
Package Description
BGA,
MO-163, BGA-119
Pin Count
119
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.B.2.B
HTS Code
8542.32.00.41
Access Time-Max
12 ns
10 ns
JESD-30 Code
R-PBGA-B119
R-PBGA-B119
JESD-609 Code
e1
Length
22 mm
Memory Density
6291456 bit
6291456 bit
Memory IC Type
STANDARD SRAM
SRAM MODULE
Memory Width
24
24
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
119
119
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX24
256KX24
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.99 mm
Supply Voltage-Max (Vsup)
3.6 V
3.465 V
Supply Voltage-Min (Vsup)
3 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
Base Number Matches
4
1
Category CO2 Kg
12
Compliance Temperature Grade
Commercial: +0C to +70C
Compare GS76024AGB-12 with alternatives
Compare EDI8L24257V10BC with alternatives