GS74116GP-10T vs 71V416S10BEI8 feature comparison

GS74116GP-10T GSI Technology

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71V416S10BEI8 Integrated Device Technology Inc

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GSI TECHNOLOGY INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TSOP2 BGA
Package Description TSOP2, 9 X 9 MM, BGA-48
Pin Count 44 48
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 10 ns 10 ns
JESD-30 Code R-PDSO-G44 S-PBGA-B48
JESD-609 Code e3 e0
Length 18.41 mm 9 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 16 16
Moisture Sensitivity Level 3 4
Number of Functions 1 1
Number of Terminals 44 48
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 256KX16 256KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 TFBGA
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, THIN PROFILE GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 0.8 mm 0.75 mm
Terminal Position DUAL BOTTOM
Width 10.16 mm 9 mm
Base Number Matches 1 2
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code BGA48,6X8,30
Peak Reflow Temperature (Cel) 225
Standby Current-Max 0.02 A
Standby Voltage-Min 3 V
Supply Current-Max 0.2 mA
Time@Peak Reflow Temperature-Max (s) 30

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