GS70328GS-15I
vs
P4C164-45DWC
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
GSI TECHNOLOGY
|
PYRAMID SEMICONDUCTOR CORP
|
| Part Package Code |
TSOP
|
DIP
|
| Package Description |
TSOP1,
|
DIP,
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
15 ns
|
45 ns
|
| JESD-30 Code |
R-PDSO-G28
|
R-CDIP-T28
|
| JESD-609 Code |
e3
|
e0
|
| Length |
11.8 mm
|
|
| Memory Density |
262144 bit
|
65536 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Number of Words |
32768 words
|
8192 words
|
| Number of Words Code |
32000
|
8000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
32KX8
|
8KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
TSOP1
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.2 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.55 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
8 mm
|
15.24 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare GS70328GS-15I with alternatives
Compare P4C164-45DWC with alternatives