GS4576S09L-25I vs GS4576S09GL-25 feature comparison

GS4576S09L-25I GSI Technology

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GS4576S09GL-25 GSI Technology

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code End Of Life End Of Life
Ihs Manufacturer GSI TECHNOLOGY GSI TECHNOLOGY
Part Package Code BGA BGA
Package Description TFBGA, TFBGA,
Pin Count 144 144
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.32 8542.32.00.32
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B144 R-PBGA-B144
Length 18.5 mm 18.5 mm
Memory Density 603979776 bit 603979776 bit
Memory IC Type DDR DRAM DDR DRAM
Memory Width 9 9
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 67108864 words 67108864 words
Number of Words Code 64000000 64000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 64MX9 64MX9
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 11 mm 11 mm
Base Number Matches 1 1
JESD-609 Code e1
Moisture Sensitivity Level 3
Terminal Finish TIN SILVER COPPER

Compare GS4576S09L-25I with alternatives

Compare GS4576S09GL-25 with alternatives