GS4288C09GL-18 vs MT49H32M9BM-25IT feature comparison

GS4288C09GL-18 GSI Technology

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MT49H32M9BM-25IT Micron Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer GSI TECHNOLOGY MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description TBGA, BGA, BGA144,12X18,40/32
Pin Count 144 144
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.28 8542.32.00.28
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Additional Feature AUTO REFRESH AUTO REFRESH
JESD-30 Code R-PBGA-B144 R-PBGA-B144
Memory Density 301989888 bit 301989888 bit
Memory IC Type DDR DRAM DDR DRAM
Memory Width 9 9
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Organization 32MX9 32MX9
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.2 mm 0.93 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 11 mm 11 mm
Base Number Matches 4 2
Access Time-Max 0.25 ns
Clock Frequency-Max (fCLK) 400 MHz
I/O Type COMMON
JESD-609 Code e1
Length 18.5 mm
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Characteristics 3-STATE
Package Equivalence Code BGA144,12X18,40/32
Qualification Status Not Qualified
Sequential Burst Length 2,4,8
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER

Compare GS4288C09GL-18 with alternatives

Compare MT49H32M9BM-25IT with alternatives