GS2974ACTE3
vs
LMH0344GRX/NOPB
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
GENNUM CORP
|
TEXAS INSTRUMENTS INC
|
| Package Description |
QCCN, LCC16,.16SQ,25
|
TFBGA, BGA25,5X5,20
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PQCC-N16
|
S-PBGA-B25
|
| Number of Terminals |
16
|
25
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCN
|
TFBGA
|
| Package Equivalence Code |
LCC16,.16SQ,25
|
BGA25,5X5,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
98 mA
|
0.1 mA
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.635 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
| Length |
|
3 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Functions |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
1.1 mm
|
| Telecom IC Type |
|
LINE EQUALIZER
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
3 mm
|
|
|
|
Compare LMH0344GRX/NOPB with alternatives