GS1B-TS05-T
vs
ES1B
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS
|
ONSEMI
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
JESD-609 Code |
e0
|
e3
|
Peak Reflow Temperature (Cel) |
240
|
260
|
Terminal Finish |
TIN LEAD
|
Matte Tin (Sn) - annealed
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
SMA
|
Package Description |
|
SMA, 2 PIN
|
Manufacturer Package Code |
|
403AE
|
HTS Code |
|
8541.10.00.80
|
Factory Lead Time |
|
30 Weeks, 5 Days
|
Samacsys Manufacturer |
|
onsemi
|
Configuration |
|
SINGLE
|
Diode Element Material |
|
SILICON
|
Diode Type |
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
|
0.92 V
|
JEDEC-95 Code |
|
DO-214AC
|
JESD-30 Code |
|
R-PDSO-C2
|
Moisture Sensitivity Level |
|
1
|
Non-rep Pk Forward Current-Max |
|
30 A
|
Number of Elements |
|
1
|
Number of Phases |
|
1
|
Number of Terminals |
|
2
|
Operating Temperature-Max |
|
150 °C
|
Operating Temperature-Min |
|
-55 °C
|
Output Current-Max |
|
1 A
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Power Dissipation-Max |
|
1.47 W
|
Qualification Status |
|
Not Qualified
|
Rep Pk Reverse Voltage-Max |
|
100 V
|
Reverse Recovery Time-Max |
|
0.015 µs
|
Surface Mount |
|
YES
|
Terminal Form |
|
C BEND
|
Terminal Position |
|
DUAL
|
|
|
|
Compare GS1B-TS05-T with alternatives
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