GS1B-TP
vs
ES1DT/R
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRO COMMERCIAL COMPONENTS CORP
NXP SEMICONDUCTORS
Part Package Code
DO-214AC
DO-214AC
Package Description
HSMA, 2 PIN
PLASTIC PACKAGE-2
Pin Count
2
2
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.80
8541.10.00.80
Samacsys Manufacturer
MCC
Application
GENERAL PURPOSE
ULTRA FAST RECOVERY
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
1.1 V
1.1 V
JEDEC-95 Code
DO-214AC
DO-214AC
JESD-30 Code
R-PDSO-C2
R-PDSO-C2
JESD-609 Code
e3
Moisture Sensitivity Level
1
Non-rep Pk Forward Current-Max
30 A
25 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
150 °C
175 °C
Operating Temperature-Min
-55 °C
-65 °C
Output Current-Max
1 A
1 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Rep Pk Reverse Voltage-Max
100 V
200 V
Reverse Current-Max
10 µA
5 µA
Surface Mount
YES
YES
Terminal Finish
Matte Tin (Sn)
Terminal Form
C BEND
C BEND
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
10
Base Number Matches
2
1
Additional Feature
LOW LEAKAGE CURRENT
Reference Standard
IEC-134
Reverse Recovery Time-Max
0.025 µs
Reverse Test Voltage
200 V
Technology
AVALANCHE
Compare GS1B-TP with alternatives
Compare ES1DT/R with alternatives