GPAF801
vs
MBRB850-BP-HF
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TAIWAN SEMICONDUCTOR CO LTD
|
MICRO COMMERCIAL COMPONENTS CORP
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Application |
GENERAL PURPOSE
|
EFFICIENCY
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.1 V
|
0.75 V
|
| Moisture Sensitivity Level |
1
|
1
|
| Non-rep Pk Forward Current-Max |
150 A
|
150 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Operating Temperature-Max |
150 °C
|
|
| Output Current-Max |
8 A
|
8 A
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Rep Pk Reverse Voltage-Max |
50 V
|
50 V
|
| Surface Mount |
NO
|
YES
|
| Base Number Matches |
2
|
1
|
| Package Description |
|
D2PAK-3/2
|
| HTS Code |
|
8541.10.00.80
|
| Additional Feature |
|
LOW LEAKAGE CURRENT, LOW POWER LOSS
|
| Diode Element Material |
|
SILICON
|
| JEDEC-95 Code |
|
TO-263AB
|
| JESD-30 Code |
|
R-PSSO-G2
|
| Number of Terminals |
|
2
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Reverse Current-Max |
|
500 µA
|
| Technology |
|
SCHOTTKY
|
| Terminal Form |
|
GULL WING
|
| Terminal Position |
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
|
5
|
|
|
|
Compare GPAF801 with alternatives
Compare MBRB850-BP-HF with alternatives