GP30GAMP
vs
EGP30G
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
FAGOR ELECTRONICA S COOP
CHANGZHOU GALAXY CENTURY MICROELECTRONICS CO LTD
Package Description
PLASTIC PACKAGE-2
Pin Count
2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.80
8541.10.00.80
Additional Feature
FORMED LEAD OPTIONS ARE AVAILABLE
Application
GENERAL PURPOSE
EFFICIENCY
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
1.1 V
1.25 V
JESD-30 Code
O-PALF-W2
O-PALF-W2
JESD-609 Code
e3
Non-rep Pk Forward Current-Max
125 A
125 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Output Current-Max
3 A
3 A
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Rep Pk Reverse Voltage-Max
400 V
400 V
Reverse Current-Max
5 µA
5 µA
Surface Mount
NO
NO
Terminal Finish
Matte Tin (Sn)
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
1
19
Part Package Code
DO-27
JEDEC-95 Code
DO-27
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Reverse Recovery Time-Max
0.05 µs
Reverse Test Voltage
400 V
Compare GP30GAMP with alternatives
Compare EGP30G with alternatives