GMP-5E3
vs
1SMB26ABK
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
CENTRAL SEMICONDUCTOR CORP
|
| Package Description |
O-PALF-W2
|
R-PDSO-C2
|
| Pin Count |
2
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Breakdown Voltage-Min |
5.5 V
|
28.9 V
|
| Case Connection |
ISOLATED
|
|
| Clamping Voltage-Max |
6.9 V
|
42.1 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
TRANS VOLTAGE SUPPRESSOR DIODE
|
TRANS VOLTAGE SUPPRESSOR DIODE
|
| JESD-30 Code |
O-PALF-W2
|
R-PDSO-C2
|
| JESD-609 Code |
e3
|
e0
|
| Non-rep Peak Rev Power Dis-Max |
500 W
|
600 W
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
LONG FORM
|
SMALL OUTLINE
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
5 W
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
5 V
|
26 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
AVALANCHE
|
AVALANCHE
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
WIRE
|
C BEND
|
| Terminal Position |
AXIAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Breakdown Voltage-Max |
|
33.2 V
|
| Breakdown Voltage-Nom |
|
31.05 V
|
| Operating Temperature-Max |
|
150 °C
|
| Operating Temperature-Min |
|
-65 °C
|
|
|
|
Compare GMP-5E3 with alternatives
Compare 1SMB26ABK with alternatives