GE28F320B3BD70
vs
SST36VF3204-70-4I-B3KE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
INTEL CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
VFBGA-48
6 X 8 MM, ROHS COMPLIANT, MO-210AB-1, TFBGA-48
Pin Count
48
48
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
70 ns
Additional Feature
BOTTOM BOOT BLOCK
Boot Block
BOTTOM
TOP
Command User Interface
YES
Data Polling
NO
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e0
e1
Length
7.286 mm
8 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Sectors/Size
8,63
Number of Terminals
48
48
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
TFBGA
Package Equivalence Code
BGA48,6X8,30
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
2.7 V
2.7 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1.2 mm
Sector Size
4K,32K
Standby Current-Max
0.000005 A
Supply Current-Max
0.055 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
NO
Type
NOR TYPE
NOR TYPE
Width
6.964 mm
6 mm
Base Number Matches
3
3
Pbfree Code
Alternate Memory Width
8
Compare GE28F320B3BD70 with alternatives
Compare SST36VF3204-70-4I-B3KE with alternatives