GE28F320B3BC90
vs
K8D3216UBCDI0900
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEL CORP
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
VFBGA-48
6 X 8.50 MM, 0.80 MM PITCH, LEAD FREE, FBGA-48
Pin Count
48
48
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Factory Lead Time
4 Weeks
Access Time-Max
90 ns
90 ns
Additional Feature
BOTTOM BOOT BLOCK
Boot Block
BOTTOM
BOTTOM
Command User Interface
YES
Data Polling
NO
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e0
Length
7.286 mm
8.5 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Sectors/Size
8,63
Number of Terminals
48
48
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
VFBGA
Package Equivalence Code
BGA48,6X8,30
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
2.7 V
2.7 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1 mm
Sector Size
4K,32K
Standby Current-Max
0.000005 A
Supply Current-Max
0.055 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
NO
Type
NOR TYPE
NOR TYPE
Width
6.964 mm
6 mm
Base Number Matches
2
1
Alternate Memory Width
8
Compare GE28F320B3BC90 with alternatives
Compare K8D3216UBCDI0900 with alternatives