GE28F160C3BC90
vs
M28W160ECT90ZB6E
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
MICRON TECHNOLOGY INC
|
| Package Description |
FBGA, BGA46,6X8,30
|
FBGA, BGA46,6X8,30
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
90 ns
|
90 ns
|
| Boot Block |
BOTTOM
|
TOP
|
| Command User Interface |
YES
|
YES
|
| Common Flash Interface |
YES
|
YES
|
| Data Polling |
NO
|
NO
|
| JESD-30 Code |
R-PBGA-B46
|
R-PBGA-B46
|
| Memory Density |
16777216 bit
|
16777216 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
|
| Number of Sectors/Size |
8,31
|
8,31
|
| Number of Terminals |
46
|
46
|
| Number of Words |
1048576 words
|
1048576 words
|
| Number of Words Code |
1000000
|
1000000
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
1MX16
|
1MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FBGA
|
FBGA
|
| Package Equivalence Code |
BGA46,6X8,30
|
BGA46,6X8,30
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
3 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sector Size |
4K,32K
|
4K,32K
|
| Standby Current-Max |
0.00002 A
|
0.000005 A
|
| Supply Current-Max |
0.018 mA
|
0.02 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.75 mm
|
0.75 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Toggle Bit |
NO
|
NO
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Base Number Matches |
3
|
3
|
|
|
|