GD80960JS-33 vs MCF5275LCVM166 feature comparison

GD80960JS-33 Intel Corporation

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MCF5275LCVM166 NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer INTEL CORP NXP SEMICONDUCTORS
Part Package Code BGA
Package Description BGA, BGA196(UNSPEC) ROHS COMPLIANT, MAPBGA-196
Pin Count 196
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 5A002.A.1
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature OPERATING CASE TEMPERATURE 0 TO 100 C ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 32 24
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 33.3 MHz 83 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B196 S-PBGA-B196
Low Power Mode YES YES
Moisture Sensitivity Level 1 3
Number of Terminals 196 196
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA196(UNSPEC)
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Speed 33 MHz 166 MHz
Supply Current-Max 250 mA
Supply Voltage-Max 3.45 V 1.6 V
Supply Voltage-Min 3.15 V 1.4 V
Supply Voltage-Nom 3.3 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
JESD-609 Code e1
Length 15 mm
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.6 mm
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Pitch 1 mm
Time@Peak Reflow Temperature-Max (s) 40
Width 15 mm

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