GD80960JF33 vs MCF5274LCVM166 feature comparison

GD80960JF33 Intel Corporation

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MCF5274LCVM166 Freescale Semiconductor

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEL CORP FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description BGA, BGA196(UNSPEC) ROHS COMPLIANT, MAPBGA-196
Pin Count 196 196
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 5A992
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer Intel NXP
Address Bus Width 32 24
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 33.3 MHz 83 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B196 S-PBGA-B196
Low Power Mode YES YES
Number of Terminals 196 196
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA196(UNSPEC) BGA196,14X14,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Speed 33 MHz 166 MHz
Supply Current-Max 320 mA 175 mA
Supply Voltage-Max 3.45 V 1.6 V
Supply Voltage-Min 3.15 V 1.4 V
Supply Voltage-Nom 3.3 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 2
Pbfree Code Yes
Rohs Code Yes
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Length 15 mm
Moisture Sensitivity Level 3
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.6 mm
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER OVER NICKEL
Terminal Pitch 1 mm
Time@Peak Reflow Temperature-Max (s) 40
Width 15 mm

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