GD74S374J vs N74S374N feature comparison

GD74S374J LG Semicon Co Ltd

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N74S374N Philips Semiconductors

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer LG SEMICON CO LTD PHILIPS SEMICONDUCTORS
Package Description DIP, DIP20,.3 DIP, DIP20,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XDIP-T20 R-PDIP-T20
JESD-609 Code e0 e0
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 75000000 Hz 75000000 Hz
Max I(ol) 0.02 A 0.02 A
Number of Functions 8 8
Number of Terminals 20 20
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 140 mA 180 mA
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Base Number Matches 2 4