GD74S10 vs SN74S10N3 feature comparison

GD74S10 LG Semicon Co Ltd

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SN74S10N3 Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LG SEMICON CO LTD TEXAS INSTRUMENTS INC
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e0
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.02 A
Number of Terminals 14 14
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 27 mA 27 mA
Prop. Delay@Nom-Sup 5 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 2
Pbfree Code No
Part Package Code DIP
Pin Count 14
Family S
Length 19.305 mm
Load Capacitance (CL) 15 pF
Number of Functions 3
Number of Inputs 3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 5 ns
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

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