GD74S10 vs S54S10F883B feature comparison

GD74S10 Goldstar Electron Co Ltd

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S54S10F883B NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GOLDSTAR ELECTRON CO LTD SIGNETICS CORP
Package Description , DIP, DIP14,.3
Reach Compliance Code unknown unknown
Family S S
JESD-30 Code R-PDIP-T14 R-GDIP-T14
Load Capacitance (CL) 15 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 3 3
Number of Inputs 3 3
Number of Terminals 14 14
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 27 mA 9 mA
Propagation Delay (tpd) 5 ns 5 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 2 3
Rohs Code No
Part Package Code DIP
Pin Count 14
HTS Code 8542.39.00.01
JESD-609 Code e0
Max I(ol) 0.02 A
Package Equivalence Code DIP14,.3
Prop. Delay@Nom-Sup 5 ns
Schmitt Trigger NO
Screening Level MIL-STD-883 Class B
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

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Compare S54S10F883B with alternatives