GD74LS30J vs HD74LS30P feature comparison

GD74LS30J LG Semicon Co Ltd

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HD74LS30P Hitachi Ltd

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer LG SEMICON CO LTD HITACHI LTD
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-XDIP-T14 R-PDIP-T14
JESD-609 Code e0
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.008 A 0.008 A
Number of Terminals 14 14
Operating Temperature-Max 70 °C 75 °C
Operating Temperature-Min -20 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 1.1 mA 1.1 mA
Prop. Delay@Nom-Sup 20 ns 20 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL EXTENDED
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 2
Part Package Code DIP
Pin Count 14
Family LS
Length 19.2 mm
Load Capacitance (CL) 15 pF
Number of Functions 1
Number of Inputs 8
Propagation Delay (tpd) 20 ns
Seated Height-Max 5.06 mm
Width 7.62 mm

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