GD74LS26
vs
SN74LS26N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LG SEMICON CO LTD
MOTOROLA INC
Package Description
DIP, DIP14,.3
646-06
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDIP-T14
R-PDIP-T14
JESD-609 Code
e0
e0
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.008 A
Number of Terminals
14
14
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Characteristics
OPEN-COLLECTOR
OPEN-COLLECTOR
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
4.4 mA
4.4 mA
Prop. Delay@Nom-Sup
32 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
5
Additional Feature
IOH = 1000UA @ VOH =15V; IOL = 8MA @ VOL = 0.5V
Family
LS
Length
18.86 mm
Load Capacitance (CL)
15 pF
Number of Functions
4
Number of Inputs
2
Propagation Delay (tpd)
28 ns
Seated Height-Max
4.69 mm
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Width
7.62 mm
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