GD74LS08J
vs
HD74LS08P
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GOLDSTAR ELECTRON CO LTD
RENESAS ELECTRONICS CORP
Package Description
,
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
Family
LS
LS
JESD-30 Code
R-CDIP-T14
R-PDIP-T14
Load Capacitance (CL)
15 pF
Logic IC Type
AND GATE
AND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
70 °C
75 °C
Operating Temperature-Min
-20 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
8.8 mA
8.8 mA
Propagation Delay (tpd)
20 ns
20 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
COMMERCIAL EXTENDED
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
2
2
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
14
HTS Code
8542.39.00.01
Length
19.2 mm
Max I(ol)
0.008 A
Package Equivalence Code
DIP14,.3
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Prop. Delay@Nom-Sup
20 ns
Schmitt Trigger
NO
Seated Height-Max
5.06 mm
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
Compare GD74LS08J with alternatives
Compare HD74LS08P with alternatives