GD74HCT08D vs TC74HCT08AF-TP2 feature comparison

GD74HCT08D LG Semicon Co Ltd

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TC74HCT08AF-TP2 Toshiba America Electronic Components

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Rohs Code No No
Part Life Cycle Code Transferred End Of Life
Ihs Manufacturer LG SEMICON CO LTD TOSHIBA CORP
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0 e0
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.004 A
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Prop. Delay@Nom-Sup 30 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 4 1
Pbfree Code No
Part Package Code SOIC
Package Description SOP,
Pin Count 14
Family HCT
Length 10.3 mm
Number of Functions 4
Number of Inputs 2
Propagation Delay (tpd) 25 ns
Seated Height-Max 1.9 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Width 5.3 mm

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