GD74HC368J
vs
5962-8681201EA
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LG SEMICON CO LTD
INTERSIL CORP
Package Description
DIP, DIP16,.3
CERAMIC, DIP-16
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Control Type
ENABLE LOW
ENABLE LOW
JESD-30 Code
R-XDIP-T16
R-GDIP-T16
JESD-609 Code
e0
e0
Load Capacitance (CL)
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.006 A
Number of Bits
6
6
Number of Functions
2
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
INVERTED
INVERTED
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
23 ns
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
6
Part Package Code
DIP
Pin Count
16
Additional Feature
ONE FUNCTION WITH TWO BITS
Family
HC/UH
Number of Ports
2
Propagation Delay (tpd)
190 ns
Screening Level
MIL-PRF-38535
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
4.5 V