GD74HC253J
vs
CD74AC153EX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GOLDSTAR ELECTRON CO LTD
HARRIS SEMICONDUCTOR
Package Description
,
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
Family
HC/UH
AC
JESD-30 Code
R-CDIP-T16
R-PDIP-T16
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
2
2
Number of Inputs
4
4
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
38 ns
151 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
1.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
2
4
Rohs Code
HTS Code
8542.39.00.01
JESD-609 Code
e0
Max I(ol)
0.012 A
Package Equivalence Code
DIP16,.3
Prop. Delay@Nom-Sup
18.6 ns
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Compare GD74HC253J with alternatives
Compare CD74AC153EX with alternatives