GD74HC113D
vs
MC74LCX74DG
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
GOLDSTAR ELECTRON CO LTD
ONSEMI
Package Description
,
SOIC-14
Reach Compliance Code
unknown
compliant
Family
HC/UH
LVC/LCX/Z
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
J-K FLIP-FLOP
D FLIP-FLOP
Number of Bits
2
1
Number of Functions
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Propagation Delay (tpd)
40 ns
8.4 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
6 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Trigger Type
NEGATIVE EDGE
POSITIVE EDGE
fmax-Min
25 MHz
150 MHz
Base Number Matches
1
1
Pbfree Code
Yes
Part Package Code
SOIC-14 NB
Pin Count
14
Manufacturer Package Code
751A-03
HTS Code
8542.39.00.01
Factory Lead Time
12 Weeks
Samacsys Manufacturer
onsemi
JESD-609 Code
e3
Length
8.65 mm
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Package Equivalence Code
SOP14,.25
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
7 ns
Seated Height-Max
1.75 mm
Terminal Finish
MATTE TIN
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
Compare GD74HC113D with alternatives
Compare MC74LCX74DG with alternatives