GD74HC113D vs MC74LCX74DG feature comparison

GD74HC113D Goldstar Electron Co Ltd

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MC74LCX74DG onsemi

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer GOLDSTAR ELECTRON CO LTD ONSEMI
Package Description , SOIC-14
Reach Compliance Code unknown compliant
Family HC/UH LVC/LCX/Z
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type J-K FLIP-FLOP D FLIP-FLOP
Number of Bits 2 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 40 ns 8.4 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE POSITIVE EDGE
fmax-Min 25 MHz 150 MHz
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code SOIC-14 NB
Pin Count 14
Manufacturer Package Code 751A-03
HTS Code 8542.39.00.01
Factory Lead Time 12 Weeks
Samacsys Manufacturer onsemi
JESD-609 Code e3
Length 8.65 mm
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.25
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 7 ns
Seated Height-Max 1.75 mm
Terminal Finish MATTE TIN
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm

Compare GD74HC113D with alternatives

Compare MC74LCX74DG with alternatives