GD74HC08D vs SN74HC08DRE4 feature comparison

GD74HC08D MagnaChip Semiconductor Ltd

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SN74HC08DRE4 Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MAGNACHIP SEMICONDUCTOR LTD TEXAS INSTRUMENTS INC
Package Description SOP, SOP, SOP14,.25
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Logic IC Type AND GATE AND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 115 ns 125 ns
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Base Number Matches 3 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code SOIC
Pin Count 14
ECCN Code EAR99
Samacsys Manufacturer Texas Instruments
JESD-609 Code e4
Length 8.65 mm
Load Capacitance (CL) 50 pF
Max I(ol) 0.0052 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.25
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 0.02 mA
Prop. Delay@Nom-Sup 25 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.75 mm
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 3.91 mm

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Compare SN74HC08DRE4 with alternatives