GD74HC08
vs
MC54HC08AJ
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MAGNACHIP SEMICONDUCTOR LTD
MOTOROLA INC
Package Description
DIP,
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDIP-T14
R-GDIP-T14
Logic IC Type
AND GATE
AND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
115 ns
22 ns
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
4
3
Rohs Code
JESD-609 Code
e0
Length
19.495 mm
Load Capacitance (CL)
50 pF
Qualification Status
Not Qualified
Seated Height-Max
5.08 mm
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare GD74HC08 with alternatives
Compare MC54HC08AJ with alternatives