GD74HC08
vs
74HC08D
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
SK HYNIX INC
PHILIPS SEMICONDUCTORS
Package Description
DIP, DIP14,.3
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
JESD-30 Code
R-PDIP-T14
R-PDSO-G14
JESD-609 Code
e0
e4
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
AND GATE
AND GATE
Max I(ol)
0.004 A
0.004 A
Number of Functions
4
Number of Inputs
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP14,.3
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Prop. Delay@Nom-Sup
23 ns
27 ns
Propagation Delay (tpd)
115 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn/Pb)
NICKEL PALLADIUM GOLD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
4
4
Moisture Sensitivity Level
1
Packing Method
TUBE
Peak Reflow Temperature (Cel)
260
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