GD74HC08 vs 74HC08D feature comparison

GD74HC08 SK Hynix Inc

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74HC08D Philips Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer SK HYNIX INC PHILIPS SEMICONDUCTORS
Package Description DIP, DIP14,.3
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e0 e4
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.004 A 0.004 A
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 23 ns 27 ns
Propagation Delay (tpd) 115 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb) NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 4 4
Moisture Sensitivity Level 1
Packing Method TUBE
Peak Reflow Temperature (Cel) 260

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