GD54HCT32J
vs
SN54HCT32J
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LG SEMICON CO LTD
TEXAS INSTRUMENTS INC
Package Description
DIP, DIP14,.3
DIP, DIP14,.3
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-XDIP-T14
R-GDIP-T14
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
OR GATE
OR GATE
Max I(ol)
0.004 A
0.004 A
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
36 ns
35 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
1
Part Package Code
DIP
Pin Count
14
Family
HCT
Length
19.56 mm
Number of Functions
4
Number of Inputs
2
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
35 ns
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
Compare SN54HCT32J with alternatives