GD54HCT273J vs TC74HCT273AP feature comparison

GD54HCT273J Goldstar Electron Co Ltd

Buy Now Datasheet

TC74HCT273AP Toshiba America Electronic Components

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GOLDSTAR ELECTRON CO LTD TOSHIBA CORP
Package Description , DIP, DIP20,.3
Reach Compliance Code unknown unknown
Family HCT HCT
JESD-30 Code R-CDIP-T20 R-PDIP-T20
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 50 ns 38 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 18 MHz 90 MHz
Base Number Matches 2 1
Rohs Code Yes
Part Package Code DIP
Pin Count 20
HTS Code 8542.39.00.01
Length 24.6 mm
Max Frequency@Nom-Sup 28000000 Hz
Max I(ol) 0.004 A
Package Equivalence Code DIP20,.3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 4.45 mm
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

Compare GD54HCT273J with alternatives

Compare TC74HCT273AP with alternatives