GD54HCT112J
vs
HCTS112D/SAMPLE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
LG SEMICON CO LTD
HARRIS SEMICONDUCTOR
Package Description
DIP, DIP16,.3
,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-XDIP-T16
R-CDIP-T16
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
J-K FLIP-FLOP
J-K FLIP-FLOP
Max Frequency@Nom-Sup
18000000 Hz
Max I(ol)
0.004 A
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
NEGATIVE EDGE
NEGATIVE EDGE
Base Number Matches
2
2
Family
HCT
Number of Bits
2
Output Polarity
COMPLEMENTARY
Propagation Delay (tpd)
42 ns
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V