GD54HC02J vs M74HC02B1R feature comparison

GD54HC02J Goldstar Electron Co Ltd

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M74HC02B1R STMicroelectronics

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer GOLDSTAR ELECTRON CO LTD STMICROELECTRONICS
Package Description , PLASTIC, DIP-14
Reach Compliance Code unknown compliant
Family HC/UH HC/UH
JESD-30 Code R-CDIP-T14 R-PDIP-T14
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NOR GATE NOR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 26 ns 110 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Pin Count 14
HTS Code 8542.39.00.01
Samacsys Manufacturer STMicroelectronics
JESD-609 Code e3
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code DIP14,.3
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 22 ns
Schmitt Trigger NO
Seated Height-Max 5.1 mm
Terminal Finish MATTE TIN
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) 40
Width 7.62 mm

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