GD4050BJ
vs
HEF4050BPB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
GOLDSTAR ELECTRON CO LTD
NXP SEMICONDUCTORS
Package Description
,
DIP,
Reach Compliance Code
unknown
unknown
Additional Feature
CMOS-TTL LEVEL TRANSLATOR
CMOS-TTL LEVEL TRANSLATOR
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-CDIP-T16
R-PDIP-T16
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUFFER
BUFFER
Number of Functions
6
6
Number of Inputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
95 ns
70 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
15 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
HTS Code
8542.39.00.01
Length
21.6 mm
Seated Height-Max
4.7 mm
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare GD4050BJ with alternatives
Compare HEF4050BPB with alternatives