GC5018IZDL
vs
AWT6271RM20P8
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
ANADIGICS INC
|
| Part Package Code |
BGA
|
BCC
|
| Package Description |
BGA-305
|
4 X 4 MM, 1.10 MM HEIGHT, ROHS COMPLIANT, SMT-10
|
| Pin Count |
305
|
10
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B305
|
S-XBCC-N10
|
| JESD-609 Code |
e1
|
|
| Length |
19 mm
|
4 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
305
|
10
|
| Operating Temperature-Max |
85 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-20 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
BGA
|
HQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
CHIP CARRIER, HEAT SINK/SLUG
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.02 mm
|
1.08 mm
|
| Supply Voltage-Nom |
1.5 V
|
3.4 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Telecom IC Type |
RF AND BASEBAND CIRCUIT
|
RF AND BASEBAND CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
1 mm
|
0.85 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
19 mm
|
4 mm
|
| Base Number Matches |
1
|
2
|
|
|
|