GBPC25-00
vs
GBPC25-00S-G
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SANGDEST MICROELECTRONICS (NANJING) CO LTD
|
SANGDEST MICROELECTRONICS (NANJING) CO LTD
|
Package Description |
R-PUFM-D4
|
R-PSFM-P4
|
Reach Compliance Code |
compliant
|
unknown
|
Additional Feature |
LOW POWER LOSS
|
HIGH RELIABILITY
|
Breakdown Voltage-Min |
50 V
|
50 V
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
BRIDGE, 4 ELEMENTS
|
BRIDGE, 4 ELEMENTS
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
BRIDGE RECTIFIER DIODE
|
BRIDGE RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
1.1 V
|
1.1 V
|
JESD-30 Code |
R-PUFM-D4
|
R-PSFM-T4
|
Non-rep Pk Forward Current-Max |
300 A
|
300 A
|
Number of Elements |
4
|
4
|
Number of Phases |
1
|
1
|
Number of Terminals |
4
|
4
|
Output Current-Max |
25 A
|
25 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Standard |
UL RECOGNIZED
|
UL RECOGNIZED
|
Rep Pk Reverse Voltage-Max |
50 V
|
50 V
|
Surface Mount |
NO
|
NO
|
Terminal Form |
SOLDER LUG
|
THROUGH-HOLE
|
Terminal Position |
UPPER
|
SINGLE
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Base Number Matches |
2
|
2
|
|
|
|
Compare GBPC25-00 with alternatives
Compare GBPC25-00S-G with alternatives