GAL26CV12-20LJI
vs
PALCE26V12H-7JC/4
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
VANTIS CORP
|
| Part Package Code |
QLCC
|
|
| Package Description |
PLASTIC, LCC-28
|
|
| Pin Count |
28
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
12 MACROCELLS; 1 EXTERNAL CLOCK; REGISTER PRELOAD; SHARED INPUT/CLOCK
|
|
| Architecture |
PAL-TYPE
|
PAL-TYPE
|
| Clock Frequency-Max |
41.6 MHz
|
125 MHz
|
| JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
| JESD-609 Code |
e0
|
e0
|
| Length |
11.5062 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Dedicated Inputs |
13
|
14
|
| Number of I/O Lines |
12
|
12
|
| Number of Inputs |
26
|
26
|
| Number of Outputs |
12
|
12
|
| Number of Product Terms |
122
|
136
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
13 DEDICATED INPUTS, 12 I/O
|
14 DEDICATED INPUTS, 12 I/O
|
| Output Function |
MACROCELL
|
MACROCELL
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Equivalence Code |
LDCC28,.5SQ
|
LDCC28,.5SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Programmable Logic Type |
EE PLD
|
EE PLD
|
| Propagation Delay |
20 ns
|
7.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
11.5062 mm
|
|
| Base Number Matches |
1
|
4
|
|
|
|
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