GAL16V8B-10LJ
vs
GAL16V8D-10LD/883
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
QLCC
DIP
Package Description
PLASTIC, LCC-20
CERAMIC, DIP-20
Pin Count
20
20
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
REGISTER PRELOAD; POWER-UP RESET
Architecture
PAL-TYPE
PAL-TYPE
Clock Frequency-Max
58.8 MHz
58.8 MHz
JESD-30 Code
S-PQCC-J20
R-GDIP-T20
JESD-609 Code
e0
e0
Length
8.9662 mm
25.27 mm
Moisture Sensitivity Level
1
1
Number of Dedicated Inputs
8
8
Number of I/O Lines
8
8
Number of Inputs
18
18
Number of Outputs
8
8
Number of Product Terms
64
64
Number of Terminals
20
20
Operating Temperature-Max
75 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
8 DEDICATED INPUTS, 8 I/O
8 DEDICATED INPUTS, 8 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
QCCJ
DIP
Package Equivalence Code
LDCC20,.4SQ
DIP20,.3
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Peak Reflow Temperature (Cel)
225
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
10 ns
10 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.57 mm
5.08 mm
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL EXTENDED
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
J BEND
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
8.9662 mm
7.62 mm
Base Number Matches
1
1
ECCN Code
3A001.A.2.C
Samacsys Manufacturer
Lattice Semiconductor
Screening Level
MIL-STD-883
Compare GAL16V8B-10LJ with alternatives
Compare GAL16V8D-10LD/883 with alternatives