G65SC112DI-1
vs
MC68A09ECP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
GTE MICROCIRCUITS
MOTOROLA INC
Package Description
DIP, DIP40,.6
DIP, DIP40,.6
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Bit Size
8
8
JESD-30 Code
R-CDIP-T40
R-PDIP-T40
JESD-609 Code
e0
e0
Number of Terminals
40
40
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP40,.6
DIP40,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Speed
1 MHz
1.5 MHz
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
NMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
2
3
Part Package Code
DIP
Pin Count
40
Address Bus Width
16
Boundary Scan
NO
Clock Frequency-Max
1.5 MHz
External Data Bus Width
8
Format
FIXED POINT
Integrated Cache
NO
Length
52.07 mm
Low Power Mode
NO
Number of DMA Channels
Number of External Interrupts
3
Number of Serial I/Os
On Chip Data RAM Width
RAM (words)
0
Seated Height-Max
5.08 mm
Supply Voltage-Max
5.25 V
Supply Voltage-Min
4.75 V
Width
15.24 mm
Compare MC68A09ECP with alternatives