G65SC112AC-1
vs
MC68HC09EL
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CALIFORNIA MICRO DEVICES CORP
MOTOROLA INC
Part Package Code
DIP
Package Description
DIP,
DIP,
Pin Count
40
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
16
16
Bit Size
8
8
Boundary Scan
NO
NO
External Data Bus Width
8
8
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
R-CDIP-T40
R-CDIP-T40
Low Power Mode
NO
YES
Number of Terminals
40
40
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.72 mm
4.32 mm
Speed
1 MHz
Supply Voltage-Max
5.25 V
Supply Voltage-Min
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
1
2
Length
50.8 mm
Number of DMA Channels
Number of External Interrupts
3
Number of Serial I/Os
On Chip Data RAM Width
RAM (words)
0
Compare G65SC112AC-1 with alternatives
Compare MC68HC09EL with alternatives