G1212F
vs
MCP6406T-H/OT
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Contact Manufacturer
|
Active
|
| Ihs Manufacturer |
GLOBAL MIXED-MODE TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
TSOP
|
SOT-23
|
| Package Description |
TSOP, TSOP5/6,.11,37
|
LSSOP, TSOP5/6,.11,37
|
| Pin Count |
5
|
5
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Bias Current-Max (IIB) @25C |
0.00005 µA
|
0.0001 µA
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
15000 µV
|
4500 µV
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G5
|
| Low-Bias |
YES
|
YES
|
| Low-Offset |
NO
|
NO
|
| Micropower |
NO
|
YES
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
5
|
| Operating Temperature-Max |
70 °C
|
150 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSOP
|
LSOP
|
| Package Equivalence Code |
TSOP5/6,.11,37
|
TSOP5/6,.11,37
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
SMALL OUTLINE, LOW PROFILE
|
| Packing Method |
TAPE AND REEL
|
TAPE AND REEL
|
| Power |
NO
|
NO
|
| Programmable Power |
NO
|
NO
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
2.4 mA
|
0.07 mA
|
| Supply Voltage Limit-Max |
7 V
|
7 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.95 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Wideband |
NO
|
NO
|
| Base Number Matches |
1
|
1
|
| Factory Lead Time |
|
5 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Average Bias Current-Max (IIB) |
|
0.0001 µA
|
| Common-mode Reject Ratio-Min |
|
63 dB
|
| Common-mode Reject Ratio-Nom |
|
78 dB
|
| JESD-609 Code |
|
e3
|
| Length |
|
2.9 mm
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Screening Level |
|
TS 16949
|
| Seated Height-Max |
|
1.45 mm
|
| Slew Rate-Nom |
|
0.5 V/us
|
| Supply Voltage-Nom (Vsup) |
|
1.8 V
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Unity Gain BW-Nom |
|
1000
|
| Voltage Gain-Min |
|
17780
|
| Width |
|
1.55 mm
|
|
|
|
Compare G1212F with alternatives
Compare MCP6406T-H/OT with alternatives