FX409J
vs
FX818D2
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
CML MICROCIRCUITS LTD
|
CML MICROCIRCUITS LTD
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
CERDIP-22
|
SOP,
|
| Pin Count |
22
|
24
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-GDIP-T22
|
R-PDSO-G24
|
| JESD-609 Code |
e0
|
|
| Length |
27.18 mm
|
15.4 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
22
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-30 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP22,.4
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.61 mm
|
2.65 mm
|
| Supply Current-Max |
0.0044 mA
|
|
| Supply Voltage-Nom |
5 V
|
3.3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
|
| Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
10.16 mm
|
7.5 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare FX409J with alternatives
Compare FX818D2 with alternatives